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C&D Semiconductor Services, Inc.
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P7000 Alloy System
Low cost ,High Throughput Ohmic / Metal Alloying
Metal ohmic alloying is unique to the compound semiconductor industry and is therefore often ignored by major equipment manufactures. The process is carried out on platforms that were not originally designed for alloying. There are two equipment choices for metal alloy- a relatively expensive RTA or a modified C&D photo coat track. |
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| C&D has come up with a cost-effective solution by developing a custom modified multiple hotplate coat track system that meets the specific needs of metal ohmic alloying. The advantages of the C&D Alloy System are simplicity, high throughput, no wafer backside contact with the hot plate, low warpage, and high reliability. |
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| System Features |
- Closed chamber inert atmosphere capability-eliminating need for Rapid Thermal Annealing (RTA)
- Capable of using multiple gases with pump out capability
- Up to 500℃ thermal process capability
- Proximity pins for uniform heating and reduced backside contamination
- Gentle wafer cooling and handling
- Process 50 mm to 200mm wafers
- High throughput at a fraction of the cost of a Rapid Thermal Annealer (RTA)
- CE Mark
- Optional dual size bridging without hardware changeover
- Upgraded ATS arms for greater repeatability
- AutoCAD layout drawings
- Minimal backside contact
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