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C&D Semiconductor Services, Inc.

 
 
 
 
P7000 Alloy System
Low cost ,High Throughput Ohmic / Metal Alloying
Metal ohmic alloying is unique to the compound semiconductor industry and is therefore often ignored by major equipment manufactures. The process is carried out on platforms that were not originally designed for alloying. There are two equipment choices for metal alloy- a relatively expensive RTA or a modified C&D photo coat track.
 
C&D has come up with a cost-effective solution by developing a custom modified multiple hotplate coat track system that meets the specific needs of metal ohmic alloying. The advantages of the C&D Alloy System are simplicity, high throughput, no wafer backside contact with the hot plate, low warpage, and high reliability.
 
System Features